IC reverse engineering and other adventures

Integrated circuit reverse engineering musings. As I try different things, a brain dump of what went well and what didn't.

Tuesday, April 20, 2010

Paypal payload

›
There have been several advancements including work on finishing the automation of the biological microscope and automation of the inverted ...
1 comment:
Thursday, April 15, 2010

IC decapping round 4: burnt perfection

›
As you can hopefully see from some of the previous posts, people employ many techniques to remove the irritating resin casing. I've see...
2 comments:
Sunday, April 11, 2010

PLACE SANDWICH HERE: the camera

›
The original camera setup involved zip-tying t-slot aluminum to the microscope neck and positioning the camera based on a series of adjustme...
2 comments:

Stepping things up

›
One of the goals for an effective setup is to automate taking pictures of the dies. Current technique is to manually move the chip around w...

IC decapping, round 3: chemical etch

›
In my last post, I discussed some of my early experience with sanding. After sanding, I tried some simple chemical etching. Unfortunately,...

IC decapping, round 2: sanding

›
The earliest way to view chips was to "cheat" and use old chips that were more readily accessible by soldering their physical caps...

IC decapping round 1: very first IC images

›
Some easy IC chips to work with are the old gold capped ceramic chips. Something like this: This particular chip is labeled MD513 76R / 740...
‹
›
Home
View web version

About Me

My photo
John McMaster
View my complete profile
Powered by Blogger.